International Symposium on 3D IC and Heterogeneous Integration

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Organizer:The Hong Kong University of Science and Technology (HKUST)Co-Organizers:Semiconductor Nanotechnology Alliance (SNA)
AI Chip Center for Emerging Smart Systems (ACCESS)
IEEE Electronics Packaging Society (EPS) Hong Kong Chapter
IEEE Electron Device Society (EDS) Hong Kong Chapter
IEEE EDA Council (CEDA) Hong Kong Chapter

 

Technical Program Committee
Members: Prof. Tim Cheng, The Hong Kong University of Science and Technology
 Prof. Lance Li, The University of Hong Kong
 Prof. Ricky Lee, The Hong Kong University of Science and Technology
Secretariat:Dr. Jeffery Lo, The Hong Kong University of Science and Technology ([email protected])
Event registration closed.
 

Date And Time

2022-04-26 @ 09:30 AM to
2022-04-28 @ 12:15 PM
 

Registration End Date

2022-04-28
 

Location

Online event
 

Event Types

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